Pateri

Rumah
Pateri

1051209

BAGIAN SAHAM: 1163

Tipe: Solder Paste, Jenis Fluks: No-Clean,

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1051208

BAGIAN SAHAM: 961

Tipe: Solder Paste, Jenis Fluks: No-Clean,

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1769647

BAGIAN SAHAM: 724

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean,

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1405711

BAGIAN SAHAM: 85

Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean,

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1769646

BAGIAN SAHAM: 797

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean,

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1817240

BAGIAN SAHAM: 1319

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C),

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1817250

BAGIAN SAHAM: 1110

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C),

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1394819

BAGIAN SAHAM: 2054

Tipe: Solder Paste, Titik lebur: 546 ~ 567°F (286 ~ 297°C),

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1042100

BAGIAN SAHAM: 750

Tipe: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.064" (1.63mm), Titik lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Fluks: No-Clean, Pengukur Kawat: 14 AWG, 16 SWG,

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1042097

BAGIAN SAHAM: 1485

Tipe: Wire Solder, Komposisi: Sn96.5Ag3.5 (96.5/3.5), Diameter: 0.063" (1.60mm), Titik lebur: 430°F (221°C), Pengukur Kawat: 14 AWG, 16 SWG,

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1354296

BAGIAN SAHAM: 1005

Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: Water Soluble,

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1354298

BAGIAN SAHAM: 1183

Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: Water Soluble,

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1179441

BAGIAN SAHAM: 2529

Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Titik lebur: 361°F (183°C), Jenis Fluks: Rosin Mildly Activated (RMA), Pengukur Kawat: 20 AWG, 21 SWG,

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1179443

BAGIAN SAHAM: 4849

Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.022" (0.56mm), Titik lebur: 361°F (183°C), Jenis Fluks: Rosin Mildly Activated (RMA), Pengukur Kawat: 23 AWG, 24 SWG,

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1372425

BAGIAN SAHAM: 9171

Tipe: Solder Paste, Jenis Fluks: No-Clean,

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1371245

BAGIAN SAHAM: 6982

Tipe: Solder Paste, Jenis Fluks: No-Clean,

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1007354

BAGIAN SAHAM: 1447

Tipe: Solder Paste, Komposisi: Bi58Sn42 (58/42), Titik lebur: 281°F (138°C), Jenis Fluks: No-Clean,

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1728117

BAGIAN SAHAM: 88

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean,

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1844674

BAGIAN SAHAM: 93

Tipe: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Titik lebur: 411 ~ 424°F (209 ~ 218°C), Jenis Fluks: No-Clean,

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1844657

BAGIAN SAHAM: 63

Tipe: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Titik lebur: 410 ~ 424°F (209 ~ 218°C), Jenis Fluks: No-Clean,

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1993881

BAGIAN SAHAM: 824

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean,

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1844644

BAGIAN SAHAM: 47

Tipe: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Titik lebur: 409 ~ 424°F (209 ~ 218°C), Jenis Fluks: No-Clean,

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1846154

BAGIAN SAHAM: 79

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean,

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1844641

BAGIAN SAHAM: 97

Tipe: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Titik lebur: 408 ~ 424°F (209 ~ 218°C), Jenis Fluks: No-Clean,

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1434537

BAGIAN SAHAM: 46

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 350°F (177°C), Jenis Fluks: No-Clean,

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1434501

BAGIAN SAHAM: 49

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 350°F (177°C), Jenis Fluks: No-Clean,

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1844685

BAGIAN SAHAM: 41

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 401 ~ 424°F (205 ~ 218°C), Jenis Fluks: No-Clean,

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1434504

BAGIAN SAHAM: 27

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 350°F (177°C), Jenis Fluks: No-Clean,

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1747469

BAGIAN SAHAM: 156

Tipe: Solder Paste, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean,

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1354222

BAGIAN SAHAM: 9183

Tipe: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Titik lebur: 354°F (179°C), Jenis Fluks: Water Soluble,

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1405673

BAGIAN SAHAM: 9223

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: Water Soluble,

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1405650

BAGIAN SAHAM: 9214

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: Water Soluble,

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1354291

BAGIAN SAHAM: 9161

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: Water Soluble,

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1354250

BAGIAN SAHAM: 6927

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: Water Soluble,

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1354225

BAGIAN SAHAM: 9135

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: Water Soluble,

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2040987

BAGIAN SAHAM: 91

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: Water Soluble,

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126

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