Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean, Pengukur Kawat: 20 AWG, 21 SWG,
Tipe: Wire Solder, Komposisi: Pb93.5Sn5Ag1.5 (93.5/5/1.5), Diameter: 0.022" (0.56mm), Titik lebur: 565 ~ 574°F (296 ~ 301°C), Jenis Fluks: Rosin Activated (RA), Pengukur Kawat: 23 AWG, 24 SWG,
Tipe: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.015" (0.38mm), Titik lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Fluks: Rosin Activated (RA), Pengukur Kawat: 27 AWG, 28 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean, Pengukur Kawat: 27 AWG, 28 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Titik lebur: 361°F (183°C), Jenis Fluks: Water Soluble, Pengukur Kawat: 27 AWG, 28 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean, Pengukur Kawat: 22 AWG, 23 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Titik lebur: 361°F (183°C), Jenis Fluks: Rosin Activated (RA), Pengukur Kawat: 22 AWG, 23 SWG,
Tipe: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.040" (1.02mm), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean, Pengukur Kawat: 18 AWG, 19 SWG,
Tipe: Wire Solder, Diameter: 0.015" (0.38mm), Jenis Fluks: No-Clean, Pengukur Kawat: 27 AWG, 28 SWG,
Tipe: Wire Solder, Diameter: 0.022" (0.56mm), Jenis Fluks: No-Clean, Pengukur Kawat: 23 AWG, 24 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.022" (0.56mm), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean, Pengukur Kawat: 23 AWG, 24 SWG,
Tipe: Wire Solder, Diameter: 0.040" (1.02mm), Jenis Fluks: No-Clean, Pengukur Kawat: 18 AWG, 19 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Titik lebur: 361°F (183°C), Jenis Fluks: Rosin Mildly Activated (RMA), Pengukur Kawat: 27 AWG, 28 SWG,
Tipe: Wire Solder, Komposisi: Sn50Pb48.5Cu1.5 (50/48.5/1.5), Diameter: 0.032" (0.81mm), Titik lebur: 361 ~ 420°F (183 ~ 216°C), Jenis Fluks: Rosin Activated (RA), Pengukur Kawat: 20 AWG, 21 SWG,
Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: Water Soluble,
Tipe: Wire Solder, Komposisi: Sn97Cu3 (97/3), Diameter: 0.128" (3.25mm), Pengukur Kawat: 8 AWG, 10 SWG,
Tipe: Wire Solder, Komposisi: Sn50Pb48.5Cu1.5 (50/48.5/1.5), Diameter: 0.048" (1.22mm), Titik lebur: 361 ~ 420°F (183 ~ 216°C), Jenis Fluks: Rosin Activated (RA), Pengukur Kawat: 16 AWG, 18 SWG,
Tipe: Bar Solder, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C),
Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Jenis Fluks: No-Clean,
Tipe: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.032" (0.81mm), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean, Pengukur Kawat: 20 AWG, 21 SWG,
Tipe: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.022" (0.56mm), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean, Pengukur Kawat: 23 AWG, 24 SWG,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean, Pengukur Kawat: 14 AWG, 16 SWG,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.048" (1.22mm), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean, Pengukur Kawat: 16 AWG, 18 SWG,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.022" (0.56mm), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean, Pengukur Kawat: 23 AWG, 24 SWG,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean, Pengukur Kawat: 20 AWG, 21 SWG,
Tipe: Bar Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Titik lebur: 440 ~ 464°F (227 ~ 240°C),
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Titik lebur: 423°F (217°C), Jenis Fluks: Water Soluble, Pengukur Kawat: 20 AWG, 21 SWG,
Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.064" (1.63mm), Titik lebur: 440 ~ 464°F (227 ~ 240°C), Jenis Fluks: No-Clean, Pengukur Kawat: 14 AWG, 16 SWG,
Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean,
