| Tipe | Deskripsi |
| Status Bagian | Active |
|---|---|
| Tipe | Solder Paste |
| Komposisi | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 |
| Diameter | - |
| Titik lebur | 409 ~ 424°F (209 ~ 218°C) |
| Jenis Fluks | No-Clean |
| Pengukur Kawat | - |
| Proses | Lead Free |
| Untuk m | Jar, 17.64 oz (500g) |
| Umur simpan | 6 Months |
| Umur Simpan Mulai | Date of Manufacture |
| Suhu Penyimpanan / Pendinginan | - |
| ROHS Status | Compliant RoHS. |
|---|---|
| Tingkat sensitivitas kelembaban (MSL) | Tak dapat diterapkan |
| Status siklus hidup | Usang / Akhir Kehidupan |
| Stok kategori. | Stok tersedia |
