Tipe: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Titik lebur: 411 ~ 424°F (209 ~ 218°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Titik lebur: 410 ~ 424°F (209 ~ 218°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Titik lebur: 409 ~ 424°F (209 ~ 218°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Titik lebur: 408 ~ 424°F (209 ~ 218°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 350°F (177°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 401 ~ 424°F (205 ~ 218°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423°F (217°C),
Tipe: Solder Paste, Titik lebur: 546 ~ 567°F (286 ~ 297°C),
Tipe: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.064" (1.63mm), Titik lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Fluks: No-Clean, Pengukur Kawat: 14 AWG, 16 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Titik lebur: 361°F (183°C), Pengukur Kawat: 27 AWG, 28 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.125" (3.18mm), Titik lebur: 361°F (183°C), Pengukur Kawat: 8 AWG, 10 SWG,
Tipe: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.062" (1.57mm), Titik lebur: 361 ~ 374°F (183 ~ 190°C), Pengukur Kawat: 14 AWG, 16 SWG,
Tipe: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.125" (3.18mm), Titik lebur: 361 ~ 374°F (183 ~ 190°C), Pengukur Kawat: 8 AWG, 10 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.062" (1.57mm), Titik lebur: 361°F (183°C), Pengukur Kawat: 14 AWG, 16 SWG,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.093" (2.36mm), Titik lebur: 423 ~ 424°F (217 ~ 218°C), Pengukur Kawat: 11 AWG, 13 SWG,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.125" (3.18mm), Titik lebur: 423 ~ 424°F (217 ~ 218°C), Pengukur Kawat: 8 AWG, 10 SWG,
Tipe: Wire Solder, Komposisi: Sn99 (99), Diameter: 0.045" (1.14mm), Pengukur Kawat: 17 AWG, 18 SWG,
Tipe: Wire Solder, Komposisi: Sn99 (99), Diameter: 0.078" (1.98mm), Pengukur Kawat: 12 AWG, 14 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Titik lebur: 361°F (183°C), Pengukur Kawat: 20 AWG, 22 SWG,
Tipe: Wire Solder, Komposisi: Sn99 (99), Diameter: 0.062" (1.57mm), Pengukur Kawat: 14 AWG, 16 SWG,
Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.047" (1.19mm), Titik lebur: 440°F (227°C), Jenis Fluks: Rosin Activated (RA), Pengukur Kawat: 17 AWG, 18 SWG,
Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.039" (0.99mm), Titik lebur: 440°F (227°C), Jenis Fluks: Rosin Activated (RA), Pengukur Kawat: 18 AWG, 19 SWG,
Tipe: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.047" (1.19mm), Titik lebur: 360°F (180°C), Jenis Fluks: Rosin Activated (RA), Pengukur Kawat: 17 AWG, 18 SWG,