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0RFQ / Pesanan

Adaptor, Papan Breakout

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  • Adaptor, Papan Breakout
PA0035
Chip Quik Inc.

PA0035

BAGIAN SAHAM: 15350

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSSOP, Jumlah Posisi: 20, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0003
Chip Quik Inc.

PA0003

BAGIAN SAHAM: 21080

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOIC, Jumlah Posisi: 14, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0009
Chip Quik Inc.

PA0009

BAGIAN SAHAM: 13848

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOIC, Jumlah Posisi: 24, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0032
Chip Quik Inc.

PA0032

BAGIAN SAHAM: 23036

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSSOP, Jumlah Posisi: 8, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PCB3008-1
Chip Quik Inc.

PCB3008-1

BAGIAN SAHAM: 22967

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSSOP, Jumlah Posisi: 14, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0085
Chip Quik Inc.

PA0085

BAGIAN SAHAM: 27278

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOT-23, SC-59, Jumlah Posisi: 6, Nada: 0.037" (0.95mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PCB3007-1
Chip Quik Inc.

PCB3007-1

BAGIAN SAHAM: 35045

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOT-23, Jumlah Posisi: 6, Nada: 0.037" (0.95mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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FPC050P010
Chip Quik Inc.

FPC050P010

BAGIAN SAHAM: 19896

Jenis Papan Proto: SMD to DIP, Paket Diterima: FPC Connector, Jumlah Posisi: 10, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PCB3005A1
Chip Quik Inc.

PCB3005A1

BAGIAN SAHAM: 35097

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOIC, Jumlah Posisi: 8, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0026
Chip Quik Inc.

PA0026

BAGIAN SAHAM: 20990

Jenis Papan Proto: SMD to DIP, Paket Diterima: MSOP, uMAX, uSOP, Jumlah Posisi: 8, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0034
Chip Quik Inc.

PA0034

BAGIAN SAHAM: 17524

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSSOP, Jumlah Posisi: 16, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0033
Chip Quik Inc.

PA0033

BAGIAN SAHAM: 19886

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSSOP, Jumlah Posisi: 14, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0042
Chip Quik Inc.

PA0042

BAGIAN SAHAM: 23014

Jenis Papan Proto: SMD to DIP, Paket Diterima: VSSOP, Jumlah Posisi: 8, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0001
Chip Quik Inc.

PA0001

BAGIAN SAHAM: 21042

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOIC, Jumlah Posisi: 8, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0006
Chip Quik Inc.

PA0006

BAGIAN SAHAM: 17976

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOIC, Jumlah Posisi: 16, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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