Adaptor, Papan Breakout | Prototyping, Produk Fabrikasi | 15

DC1206S-10X

BAGIAN SAHAM: 14966

Jenis Papan Proto: SMD to DIP, Paket Diterima: 1206, Jumlah Posisi: 2, Ketebalan papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR254D254P10M

BAGIAN SAHAM: 11671

Jenis Papan Proto: Connector to DIP, Paket Diterima: 2.54mm Header, Jumlah Posisi: 10, Nada: 0.100" (2.54mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR127D254P40M

BAGIAN SAHAM: 3617

Jenis Papan Proto: Connector to DIP, Paket Diterima: 1.27mm Header, Jumlah Posisi: 40, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0106SOCKET

BAGIAN SAHAM: 4422

Jenis Papan Proto: SMD to DIP, Paket Diterima: LCC, JLCC, PLCC, Jumlah Posisi: 28, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR127D254P40F

BAGIAN SAHAM: 3654

Jenis Papan Proto: Connector to DIP, Paket Diterima: 1.27mm Header, Jumlah Posisi: 40, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

CN0072

BAGIAN SAHAM: 236

Jenis Papan Proto: Connector to Plated Through Hole, Jumlah Posisi: 200, Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

IPC0072

BAGIAN SAHAM: 10690

Jenis Papan Proto: SMD to DIP, Paket Diterima: DFN, Jumlah Posisi: 14, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0190

BAGIAN SAHAM: 4884

Jenis Papan Proto: SMD to PGA, Paket Diterima: TQFP, Jumlah Posisi: 128, Nada: 0.016" (0.40mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0189

BAGIAN SAHAM: 4553

Jenis Papan Proto: SMD to PGA, Paket Diterima: LQFP, Jumlah Posisi: 176, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR127D254P20F

BAGIAN SAHAM: 7406

Jenis Papan Proto: Connector to DIP, Paket Diterima: 1.27mm Header, Jumlah Posisi: 20, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0017

BAGIAN SAHAM: 17972

Jenis Papan Proto: SMD to DIP, Paket Diterima: SSOP, Jumlah Posisi: 16, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR200D254P20F

BAGIAN SAHAM: 7752

Jenis Papan Proto: Connector to DIP, Paket Diterima: 2.00mm Header, Jumlah Posisi: 20, Nada: 0.079" (2.00mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0210

BAGIAN SAHAM: 7760

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSOP, Jumlah Posisi: 54, Nada: 0.031" (0.80mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR127D254P20M

BAGIAN SAHAM: 7333

Jenis Papan Proto: Connector to DIP, Paket Diterima: 1.27mm Header, Jumlah Posisi: 20, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC0402S-10X

BAGIAN SAHAM: 14949

Jenis Papan Proto: SMD to DIP, Paket Diterima: 0402, Jumlah Posisi: 2, Ketebalan papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0071

BAGIAN SAHAM: 7042

Jenis Papan Proto: SMD to DIP, Paket Diterima: QFN, Jumlah Posisi: 40, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

IPC0103

BAGIAN SAHAM: 12710

Jenis Papan Proto: SMD to DIP, Paket Diterima: LGA, Jumlah Posisi: 10, Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

F200T254P08

BAGIAN SAHAM: 43355

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Jumlah Posisi: 8, Nada: 0.079" (2.00mm), Ketebalan papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0016

BAGIAN SAHAM: 17943

Jenis Papan Proto: SMD to DIP, Paket Diterima: SSOP, Jumlah Posisi: 14, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0092

BAGIAN SAHAM: 8781

Jenis Papan Proto: SMD to DIP, Paket Diterima: TQFP, Jumlah Posisi: 32, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC0805J-10X

BAGIAN SAHAM: 337

Jenis Papan Proto: SMD to Plated Through Hole, Paket Diterima: 0805, Jumlah Posisi: 2, Nada: 0.078" (1.98mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

CN0035

BAGIAN SAHAM: 13917

Jenis Papan Proto: Connector to SIP, Paket Diterima: RJ45, Ethernet Plug, Jumlah Posisi: 8, Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0062

BAGIAN SAHAM: 15369

Jenis Papan Proto: SMD to DIP, Paket Diterima: QFN, Jumlah Posisi: 16, Nada: 0.031" (0.80mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC0402J-10X

BAGIAN SAHAM: 308

Jenis Papan Proto: SMD to Plated Through Hole, Paket Diterima: 0402, Jumlah Posisi: 2, Nada: 0.036" (0.91mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

CN0007

BAGIAN SAHAM: 13878

Jenis Papan Proto: Connector to SIP, Paket Diterima: USB - B, Jumlah Posisi: 4, Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0094

BAGIAN SAHAM: 5390

Jenis Papan Proto: SMD to DIP, Paket Diterima: LQFP, TQFP, Jumlah Posisi: 48, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0107SOCKET

BAGIAN SAHAM: 3715

Jenis Papan Proto: SMD to DIP, Paket Diterima: LCC, JLCC, PLCC, Jumlah Posisi: 44, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0188

BAGIAN SAHAM: 4838

Jenis Papan Proto: SMD to PGA, Paket Diterima: LQFP, Jumlah Posisi: 144, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0049

BAGIAN SAHAM: 23000

Jenis Papan Proto: SMD to DIP, Paket Diterima: DFN, MLP, Jumlah Posisi: 6, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

CN0030

BAGIAN SAHAM: 13871

Jenis Papan Proto: Connector to SIP, Paket Diterima: DB9, Jumlah Posisi: 9, Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0194

BAGIAN SAHAM: 12726

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSSOP, Jumlah Posisi: 20, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC0603J-10X

BAGIAN SAHAM: 418

Jenis Papan Proto: SMD to Plated Through Hole, Paket Diterima: 0603, Jumlah Posisi: 2, Nada: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

FPC100P030

BAGIAN SAHAM: 12716

Jenis Papan Proto: SMD to DIP, Paket Diterima: FPC Connector, Jumlah Posisi: 30, Nada: 0.039" (1.00mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR127D254P10M

BAGIAN SAHAM: 9927

Jenis Papan Proto: Connector to DIP, Paket Diterima: 1.27mm Header, Jumlah Posisi: 10, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

F200T254P20

BAGIAN SAHAM: 21636

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Jumlah Posisi: 20, Nada: 0.079" (2.00mm), Ketebalan papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0018

BAGIAN SAHAM: 15342

Jenis Papan Proto: SMD to DIP, Paket Diterima: SSOP, Jumlah Posisi: 20, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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