Adaptor, Papan Breakout | Prototyping, Produk Fabrikasi | 15

PA0240

BAGIAN SAHAM: 5392

Jenis Papan Proto: SMD to DIP, Paket Diterima: LQFP, Jumlah Posisi: 48, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0103

BAGIAN SAHAM: 11690

Jenis Papan Proto: SMD to DIP, Paket Diterima: LGA, Jumlah Posisi: 16, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0020

BAGIAN SAHAM: 12697

Jenis Papan Proto: SMD to DIP, Paket Diterima: SSOP, Jumlah Posisi: 28, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

FPC030P025

BAGIAN SAHAM: 10664

Jenis Papan Proto: SMD to DIP, Paket Diterima: FPC Connector, Jumlah Posisi: 25, Nada: 0.012" (0.30mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0039

BAGIAN SAHAM: 10643

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSSOP, Jumlah Posisi: 38, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

F200T254P10

BAGIAN SAHAM: 38839

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Jumlah Posisi: 10, Nada: 0.079" (2.00mm), 0.100" (2.54mm), Ketebalan papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC2220J-10X

BAGIAN SAHAM: 608

Jenis Papan Proto: SMD to Plated Through Hole, Paket Diterima: 2220, Jumlah Posisi: 2, Nada: 0.209" (5.31mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC1206J-10X

BAGIAN SAHAM: 543

Jenis Papan Proto: SMD to Plated Through Hole, Paket Diterima: 1206, Jumlah Posisi: 2, Nada: 0.122" (3.10mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

IPC0088

BAGIAN SAHAM: 13898

Jenis Papan Proto: SMD to DIP, Paket Diterima: DFN, Jumlah Posisi: 10, Nada: 0.016" (0.40mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

CN0023

BAGIAN SAHAM: 6982

Jenis Papan Proto: Connector to SIP, Paket Diterima: microSD™ Card, Jumlah Posisi: 10, Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR127D254P10F

BAGIAN SAHAM: 9992

Jenis Papan Proto: Connector to DIP, Paket Diterima: 1.27mm Header, Jumlah Posisi: 10, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0041

BAGIAN SAHAM: 8226

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSSOP, Jumlah Posisi: 56, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC0603T-10X

BAGIAN SAHAM: 14958

Jenis Papan Proto: SMD to DIP, Paket Diterima: 0603, Jumlah Posisi: 2, Ketebalan papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC2924J-10X

BAGIAN SAHAM: 553

Jenis Papan Proto: SMD to Plated Through Hole, Paket Diterima: 2924, Jumlah Posisi: 2, Nada: 0.245" (6.22mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0040

BAGIAN SAHAM: 9955

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSSOP, Jumlah Posisi: 48, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

F127T254P04

BAGIAN SAHAM: 67219

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Jumlah Posisi: 4, Nada: 0.050" (1.27mm), Ketebalan papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0088

BAGIAN SAHAM: 27278

Jenis Papan Proto: SMD to DIP, Paket Diterima: SC-70, SOT-353, Jumlah Posisi: 5, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

IPC0142

BAGIAN SAHAM: 21036

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOP, Jumlah Posisi: 8, Nada: 0.100" (2.54mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

F127T254P06

BAGIAN SAHAM: 49160

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Jumlah Posisi: 6, Nada: 0.050" (1.27mm), Ketebalan papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0063

BAGIAN SAHAM: 13877

Jenis Papan Proto: SMD to DIP, Paket Diterima: QFN, Jumlah Posisi: 20, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

FPC030P045

BAGIAN SAHAM: 8231

Jenis Papan Proto: SMD to DIP, Paket Diterima: FPC Connector, Jumlah Posisi: 45, Nada: 0.012" (0.30mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

FPC050P020

BAGIAN SAHAM: 15309

Jenis Papan Proto: SMD to DIP, Paket Diterima: FPC Connector, Jumlah Posisi: 20, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0030

BAGIAN SAHAM: 12681

Jenis Papan Proto: SMD to DIP, Paket Diterima: QSOP, Jumlah Posisi: 24, Nada: 0.025" (0.64mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

F127T254P08

BAGIAN SAHAM: 43340

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Jumlah Posisi: 8, Nada: 0.050" (1.27mm), Ketebalan papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

FPC050P040

BAGIAN SAHAM: 10630

Jenis Papan Proto: SMD to DIP, Paket Diterima: FPC Connector, Jumlah Posisi: 40, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

IPC0076

BAGIAN SAHAM: 13919

Jenis Papan Proto: SMD to DIP, Paket Diterima: MSOP, Jumlah Posisi: 8, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR050D254P060

BAGIAN SAHAM: 8186

Jenis Papan Proto: SMD to DIP, Paket Diterima: 0.5mm Connector, Jumlah Posisi: 60, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

IPC0061

BAGIAN SAHAM: 13870

Jenis Papan Proto: SMD to DIP, Paket Diterima: DFN, Jumlah Posisi: 8, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

LS0002

BAGIAN SAHAM: 124131

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOT-23, Jumlah Posisi: 5, Nada: 0.037" (0.95mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0037

BAGIAN SAHAM: 12740

Jenis Papan Proto: SMD to DIP, Paket Diterima: TSSOP, Jumlah Posisi: 28, Nada: 0.026" (0.65mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0101

BAGIAN SAHAM: 15303

Jenis Papan Proto: SMD to DIP, Paket Diterima: LGA, Jumlah Posisi: 14, Nada: 0.031" (0.80mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0008

BAGIAN SAHAM: 15697

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOIC, Jumlah Posisi: 20, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0096

BAGIAN SAHAM: 4683

Jenis Papan Proto: SMD to DIP, Paket Diterima: LQFP, TQFP, VQFP, Jumlah Posisi: 64, Nada: 0.020" (0.50mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0002

BAGIAN SAHAM: 21063

Jenis Papan Proto: SMD to DIP, Paket Diterima: SOIC, Jumlah Posisi: 8, Nada: 0.050" (1.27mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0184

BAGIAN SAHAM: 17522

Jenis Papan Proto: SMD to DIP, Paket Diterima: TO-263 (DDPAK/D2PAK), Jumlah Posisi: 3, Nada: 0.100" (2.54mm), Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

CN0029

BAGIAN SAHAM: 13942

Jenis Papan Proto: Connector to SIP, Paket Diterima: DB9, Jumlah Posisi: 9, Ketebalan papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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