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SMDSWLF.020 1LB
Chip Quik Inc.

SMDSWLF.020 1LB

BAGIAN SAHAM: 148

Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 24 AWG, 25 SWG,

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SMD2SWLF.015 1OZ
Chip Quik Inc.

SMD2SWLF.015 1OZ

BAGIAN SAHAM: 270

Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Titik lebur: 441°F (227°C), Jenis Fluks: No-Clean, Water Soluble,

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SMDIN52SN48
Chip Quik Inc.

SMDIN52SN48

BAGIAN SAHAM: 598

Tipe: Wire Solder, Komposisi: In52Sn48 (52/48), Diameter: 0.031" (0.79mm), Titik lebur: 244°F (118°C), Pengukur Kawat: 20 AWG, 21 SWG,

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SMD3SW.031 2OZ
Chip Quik Inc.

SMD3SW.031 2OZ

BAGIAN SAHAM: 370

Tipe: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.031" (0.79mm), Titik lebur: 354°F (179°C), Jenis Fluks: No-Clean, Water Soluble,

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SMD2170
Chip Quik Inc.

SMD2170

BAGIAN SAHAM: 87

Tipe: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.014" (0.36mm), Titik lebur: 361°F (183°C),

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SMD291SNL500T3C
Chip Quik Inc.

SMD291SNL500T3C

BAGIAN SAHAM: 710

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean,

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SMD2060
Chip Quik Inc.

SMD2060

BAGIAN SAHAM: 762

Tipe: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.030" (0.76mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C),

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SMDSWLF.020 8OZ
Chip Quik Inc.

SMDSWLF.020 8OZ

BAGIAN SAHAM: 261

Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 24 AWG, 25 SWG,

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TS391SNL250
Chip Quik Inc.

TS391SNL250

BAGIAN SAHAM: 80

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean,

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TS391SNL10
Chip Quik Inc.

TS391SNL10

BAGIAN SAHAM: 209

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean,

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SMDSWLF.031 8OZ
Chip Quik Inc.

SMDSWLF.031 8OZ

BAGIAN SAHAM: 367

Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 20 AWG, 22 SWG,

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SMD2190
Chip Quik Inc.

SMD2190

BAGIAN SAHAM: 886

Tipe: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Titik lebur: 361°F (183°C),

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SMD4300AX500T4C
Chip Quik Inc.

SMD4300AX500T4C

BAGIAN SAHAM: 788

Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: Water Soluble,

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SMD291SNL15T4
Chip Quik Inc.

SMD291SNL15T4

BAGIAN SAHAM: 3588

Tipe: Solder Paste, Two Part Mix, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean,

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TS391SNL
Chip Quik Inc.

TS391SNL

BAGIAN SAHAM: 647

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean,

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TS391LT250
Chip Quik Inc.

TS391LT250

BAGIAN SAHAM: 136

Tipe: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Titik lebur: 281°F (138°C), Jenis Fluks: No-Clean,

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SMDSWLF.020 .4OZ
Chip Quik Inc.

SMDSWLF.020 .4OZ

BAGIAN SAHAM: 1771

Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 24 AWG, 25 SWG,

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SMD4300AX250T5
Chip Quik Inc.

SMD4300AX250T5

BAGIAN SAHAM: 820

Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: Water Soluble,

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SMD2028-25000
Chip Quik Inc.

SMD2028-25000

BAGIAN SAHAM: 68

Tipe: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.014" (0.36mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C),

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SMD4300SNL500T3C
Chip Quik Inc.

SMD4300SNL500T3C

BAGIAN SAHAM: 707

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: Water Soluble,

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SMD2SWLF.020 1OZ
Chip Quik Inc.

SMD2SWLF.020 1OZ

BAGIAN SAHAM: 314

Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Titik lebur: 441°F (227°C), Jenis Fluks: No-Clean, Water Soluble,

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SMDAL200
Chip Quik Inc.

SMDAL200

BAGIAN SAHAM: 78

Tipe: Solder Paste, Komposisi: Sn96.5Ag3.5 (96.5/3.5), Titik lebur: 430°F (221°C), Jenis Fluks: Water Soluble,

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SMD2024
Chip Quik Inc.

SMD2024

BAGIAN SAHAM: 79

Tipe: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.012" (0.31mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C),

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SMDSWLF.031 1LB
Chip Quik Inc.

SMDSWLF.031 1LB

BAGIAN SAHAM: 185

Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 20 AWG, 22 SWG,

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SMD291AX10T5
Chip Quik Inc.

SMD291AX10T5

BAGIAN SAHAM: 2453

Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean,

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