Pateri

SMD2SWLF.020 2OZ

BAGIAN SAHAM: 315

Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Titik lebur: 441°F (227°C), Jenis Fluks: No-Clean, Water Soluble,

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Chip Quik Inc.

SMD4300AX10T5

BAGIAN SAHAM: 2531

Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: Water Soluble,

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Chip Quik Inc.

SMD2SW.020 4OZ

BAGIAN SAHAM: 577

Tipe: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.020" (0.51mm), Titik lebur: 361 ~ 370°F (183 ~ 188°C), Jenis Fluks: No-Clean, Water Soluble,

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Chip Quik Inc.

Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Pengukur Kawat: 20 AWG, 22 SWG,

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Chip Quik Inc.

SMDSW.031 1LB

BAGIAN SAHAM: 179

Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 20 AWG, 22 SWG,

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Chip Quik Inc.

SMDLTLFP500T4C

BAGIAN SAHAM: 497

Tipe: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Titik lebur: 281°F (138°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

SMD291SNL500T4C

BAGIAN SAHAM: 643

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

SMD291SNL250T3

BAGIAN SAHAM: 1379

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

SMDSWLF.008 50G

BAGIAN SAHAM: 235

Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.008" (0.20mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 32 AWG, 35 SWG,

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Chip Quik Inc.

SMDLTLFP250T3

BAGIAN SAHAM: 1108

Tipe: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Titik lebur: 281°F (138°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

SMD3SW.020 8OZ

BAGIAN SAHAM: 371

Tipe: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.020" (0.51mm), Titik lebur: 354°F (179°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 24 AWG, 25 SWG,

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Chip Quik Inc.

SMDSW.031 8OZ

BAGIAN SAHAM: 258

Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 20 AWG, 22 SWG,

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Chip Quik Inc.

SMDSWLF.015 2OZ

BAGIAN SAHAM: 245

Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Water Soluble,

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Chip Quik Inc.

SMD2055

BAGIAN SAHAM: 706

Tipe: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.025" (0.64mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C),

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Chip Quik Inc.

SMDLTLFPT5

BAGIAN SAHAM: 51

Tipe: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Titik lebur: 281°F (138°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

SMD2020-25000

BAGIAN SAHAM: 49

Tipe: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.010" (0.25mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C),

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Chip Quik Inc.

SMD4300SNL500T5C

BAGIAN SAHAM: 352

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: Water Soluble,

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Chip Quik Inc.

SMD2060-25000

BAGIAN SAHAM: 2151

Tipe: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.030" (0.76mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C),

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Chip Quik Inc.

SMD291AX500T5C

BAGIAN SAHAM: 436

Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

TS391LT

BAGIAN SAHAM: 851

Tipe: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Titik lebur: 281°F (138°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

SMDLTLFPT4

BAGIAN SAHAM: 135

Tipe: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Titik lebur: 281°F (138°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

SMD291AXT5

BAGIAN SAHAM: 99

Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

SMD3SW.031 4OZ

BAGIAN SAHAM: 625

Tipe: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.031" (0.79mm), Titik lebur: 354°F (179°C), Jenis Fluks: No-Clean, Water Soluble,

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Chip Quik Inc.

SMDSW.020 8OZ

BAGIAN SAHAM: 213

Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 24 AWG, 25 SWG,

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Chip Quik Inc.

SMD2SWLF.020 1LB

BAGIAN SAHAM: 176

Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Titik lebur: 441°F (227°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 24 AWG, 25 SWG,

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Chip Quik Inc.

SMD291SNLT4

BAGIAN SAHAM: 9

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

SMD291SNL

BAGIAN SAHAM: 4598

Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean,

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Chip Quik Inc.

SMDSWLF.015 1LB

BAGIAN SAHAM: 186

Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 27 AWG, 28 SWG,

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Chip Quik Inc.

SMD2SWLF.031 8OZ

BAGIAN SAHAM: 240

Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Titik lebur: 441°F (227°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 20 AWG, 22 SWG,