Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Titik lebur: 441°F (227°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 20 AWG, 21 SWG,
Tipe: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Titik lebur: 281°F (138°C), Jenis Fluks: No-Clean,
Tipe: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.008" (0.20mm), Titik lebur: 361°F (183°C),
Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean,
Tipe: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Titik lebur: 361°F (183°C),
Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Titik lebur: 441°F (227°C), Jenis Fluks: No-Clean, Water Soluble,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 27 AWG, 28 SWG,
Tipe: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Titik lebur: 441°F (227°C), Jenis Fluks: No-Clean, Water Soluble,
Tipe: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.030" (0.76mm), Titik lebur: 361°F (183°C),
Tipe: Wire Solder, Komposisi: In97Ag3 (97/3), Diameter: 0.031" (0.79mm), Titik lebur: 289°F (143°C), Pengukur Kawat: 20 AWG, 21 SWG,
Tipe: Wire Solder, Komposisi: Bi57Sn42Ag1 (57/42/1), Diameter: 0.030" (0.76mm), Titik lebur: 281°F (138°C), Pengukur Kawat: 21 AWG, 22 SWG,
Tipe: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Titik lebur: 361°F (183°C),
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 20 AWG, 21 SWG,
Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: Water Soluble,
Tipe: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.020" (0.51mm), Titik lebur: 354°F (179°C), Jenis Fluks: No-Clean, Water Soluble,
Tipe: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.016" (0.40mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C),
Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: Water Soluble,
Tipe: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.018" (0.46mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C),
Tipe: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.008" (0.20mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C),
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Pengukur Kawat: 20 AWG, 22 SWG,
Tipe: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.012" (0.31mm), Titik lebur: 361°F (183°C),
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 20 AWG, 21 SWG,
Tipe: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean, Water Soluble, Pengukur Kawat: 20 AWG, 22 SWG,
Tipe: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.024" (0.61mm), Titik lebur: 423 ~ 428°F (217 ~ 220°C),
