Tipe: Board Level, Paket Didinginkan: Power Modules, Metode Lampiran: Bolt On, Bentuk: Rectangular, Fins, Panjangnya: 3.000" (76.20mm), Lebar: 5.000" (127.00mm),
Tipe: Top Mount, Paket Didinginkan: Power Modules, Metode Lampiran: Press Fit, Bentuk: Rectangular, Fins, Panjangnya: 4.724" (120.00mm), Lebar: 4.921" (124.99mm),
Tipe: Top Mount, Extrusion, Paket Didinginkan: Power Modules, Metode Lampiran: Press Fit, Bentuk: Rectangular, Fins, Panjangnya: 11.811" (300.00mm), Lebar: 4.921" (124.99mm),
Tipe: Board Level, Extrusion, Paket Didinginkan: Power Modules, Metode Lampiran: Bolt On, Bentuk: Rectangular, Fins, Panjangnya: 5.500" (139.70mm), Lebar: 5.000" (127.00mm),
Tipe: Top Mount, Extrusion, Paket Didinginkan: Power Modules, Metode Lampiran: Press Fit, Bentuk: Rectangular, Fins, Panjangnya: 7.087" (180.01mm), Lebar: 4.921" (124.99mm),
Tipe: Top Mount, Paket Didinginkan: Power Modules, Metode Lampiran: Bolt On, Bentuk: Rectangular, Fins, Panjangnya: 3.000" (76.20mm), Lebar: 5.000" (127.00mm),
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Push Pin, Bentuk: Rectangular, Fins, Panjangnya: 2.323" (59.00mm), Lebar: 2.280" (57.91mm),
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Push Pin, Bentuk: Square, Fins, Panjangnya: 1.732" (44.00mm), Lebar: 1.772" (45.00mm),
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Push Pin, Bentuk: Square, Fins, Panjangnya: 2.717" (69.00mm), Lebar: 2.756" (70.00mm),
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Push Pin, Bentuk: Square, Fins, Panjangnya: 3.543" (90.00mm), Lebar: 3.543" (90.00mm),
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Push Pin, Bentuk: Square, Fins, Panjangnya: 1.594" (40.50mm), Lebar: 1.575" (40.00mm),
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Push Pin, Bentuk: Square, Fins, Panjangnya: 1.969" (50.00mm), Lebar: 1.969" (50.00mm),
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Push Pin, Bentuk: Square, Fins, Panjangnya: 2.362" (60.00mm), Lebar: 2.362" (60.00mm),
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Push Pin, Bentuk: Square, Fins, Panjangnya: 3.150" (80.00mm), Lebar: 3.150" (80.00mm),
Tipe: Top Mount, Paket Didinginkan: TO-5, TO-39, Metode Lampiran: Threaded Coupling, Bentuk: Cylindrical,
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Thermal Tape, Adhesive (Included), Bentuk: Square, Pin Fins, Panjangnya: 1.063" (27.00mm), Lebar: 1.063" (27.00mm),
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Thermal Tape, Adhesive (Included), Bentuk: Square, Pin Fins, Panjangnya: 1.378" (35.00mm), Lebar: 1.378" (35.00mm),
Tipe: Top Mount, Paket Didinginkan: BGA, Metode Lampiran: Thermal Tape, Adhesive (Included), Bentuk: Square, Pin Fins, Panjangnya: 1.575" (40.00mm), Lebar: 1.575" (40.01mm),
Tipe: Board Level, Paket Didinginkan: TO-5, Metode Lampiran: Press Fit, Bentuk: Cylindrical,
Paket Didinginkan: Assorted (BGA, LGA, CPU, ASIC...), Metode Lampiran: Solder Anchor,
Tipe: Top Mount, Metode Lampiran: Adhesive, Bentuk: Square, Fins, Panjangnya: 0.750" (19.05mm), Lebar: 0.750" (19.05mm),
Paket Didinginkan: FPGA,