Paket Didinginkan: BGA, Metode Lampiran: Clip, Bentuk: Cylindrical,
Tipe: Top Mount, Extrusion, Paket Didinginkan: Power Modules, Metode Lampiran: Adhesive, Bentuk: Rectangular, Fins, Panjangnya: 12.000" (304.80mm), Lebar: 11.000" (279.40mm),
Tipe: Top Mount, Extrusion, Paket Didinginkan: Power Modules, Metode Lampiran: Adhesive, Bentuk: Rectangular, Fins, Panjangnya: 12.320" (312.93mm), Lebar: 3.420" (86.87mm),
Tipe: Board Level, Paket Didinginkan: TO-5, Metode Lampiran: Press Fit, Bentuk: Cylindrical, Panjangnya: 0.400" (10.16mm), Lebar: 0.315" (8.00mm) ID,
