Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn63Pb37 (63/37), Titik lebur: 361°F (183°C), Jenis Fluks: Water Soluble,
Tipe: Solder Paste, Komposisi: Sn95Sb5 (95/5), Titik lebur: 450 ~ 464°F (232 ~ 240°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn96.3Ag3.7 (96.3/3.7), Titik lebur: 430 ~ 444°F (221 ~ 223°C), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Titik lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Fluks: Water Soluble,
Tipe: Solder Paste, Komposisi: Sn99Cu0.7Ag0.3 (99/0.7/0.3), Jenis Fluks: No-Clean,
Tipe: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Titik lebur: 354°F (179°C), Jenis Fluks: Water Soluble,
Tipe: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Titik lebur: 354°F (179°C), Jenis Fluks: No-Clean,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean, Pengukur Kawat: 14 AWG, 16 SWG,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Titik lebur: 423°F (217°C), Jenis Fluks: Water Soluble, Pengukur Kawat: 14 AWG, 16 SWG,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Titik lebur: 423°F (217°C), Jenis Fluks: No-Clean, Pengukur Kawat: 27 AWG, 28 SWG,
Tipe: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Titik lebur: 423°F (217°C), Jenis Fluks: Rosin Mildly Activated (RMA), Pengukur Kawat: 27 AWG, 28 SWG,
