| Tipe | Deskripsi |
| Status Bagian | Active |
|---|---|
| Tipe | BGA |
| Jumlah Posisi atau Pin (Kisi) | 456 (26 x 26) |
| Pitch - Perkawinan | 0.050" (1.27mm) |
| Kontak Selesai - Perkawinan | Gold |
| Kontak Ketebalan Selesai - Kawin | 10.0µin (0.25µm) |
| Bahan Kontak - Perkawinan | Beryllium Copper |
| Jenis pemasangan: | Through Hole |
| fitur | Closed Frame |
| Penghentian | Solder |
| Pitch - Posting | 0.050" (1.27mm) |
| Kontak Selesai - Posting | Gold |
| Kontak Selesai Ketebalan - Posting | 10.0µin (0.25µm) |
| Materi Kontak - Posting | Brass |
| Bahan Perumahan | FR4 Epoxy Glass |
| Suhu Operasional | -55°C ~ 125°C |
| ROHS Status | Compliant RoHS. |
|---|---|
| Tingkat sensitivitas kelembaban (MSL) | Tak dapat diterapkan |
| Status siklus hidup | Usang / Akhir Kehidupan |
| Stok kategori. | Stok tersedia |
