| Tipe | Deskripsi |
| Status Bagian | Active |
|---|---|
| Tipe | SOIC |
| Jumlah Posisi atau Pin (Kisi) | 20 (2 x 10) |
| Pitch - Perkawinan | - |
| Kontak Selesai - Perkawinan | Gold |
| Kontak Ketebalan Selesai - Kawin | - |
| Bahan Kontak - Perkawinan | Beryllium Copper |
| Jenis pemasangan: | Through Hole |
| fitur | Closed Frame |
| Penghentian | Solder |
| Pitch - Posting | - |
| Kontak Selesai - Posting | Gold |
| Kontak Selesai Ketebalan - Posting | 30.0µin (0.76µm) |
| Materi Kontak - Posting | Beryllium Copper |
| Bahan Perumahan | Polyethersulfone (PES), Glass Filled |
| Suhu Operasional | -55°C ~ 150°C |
| ROHS Status | Compliant RoHS. |
|---|---|
| Tingkat sensitivitas kelembaban (MSL) | Tak dapat diterapkan |
| Status siklus hidup | Usang / Akhir Kehidupan |
| Stok kategori. | Stok tersedia |
